Qualcomm Announces Snapdragon 427, 626 and 653 Mobile Chipsets

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Qualcomm at its 2016 4G/5G Summit in Hong Kong earlier today announced three new mobile processors namely, Snapdragon 427 (8920), Snapdragon 626 (8853pro), and Snapdragon 653 (8976pro). These are upgraded variants of Snapdragon 425, 625, and 652 respectively. According to Qualcomm, the newly introduced chips offers 10% improve performance when compared with their predecessors.

Notably, all the three comes integrated with Qualcomm X9 LTE that offers faster internet speed and supports Quick Charge 3.0. The Snapdragon 427, 626 and 653 also supports dual camera.

Check out their complete specs below:

Qualcomm Snapdragon 427 Specifications

  • Quad-Core ARM Cortex A53 CPUs (up to 1.4GHz); 28nm LP process
  • Memory: 667MHz LPDDR3
  • Storage: eMMC 5.1
  • Graphics: Adreno 308 GPU
  • Supports up to 1280×800 displays
  • Video: 1080p @30fps capture; Hardware HEVC (H.265) encode and decode
  • Dual ISPs can support up to 16MP
  • Miracast supports (up to 720p)
  • Integrated X9 LTE with Global Mode LTE FDD, LTE TDD, WCDMA (DC-HSPA+, DC-HSUPA), CDMA1x, EV-DO, TD-SCDMA and GSM/Edge
  • Cat 7 speeds of up to 300 Mbps down via 2×20 MHz carrier aggregation in the downlink and Cat 13 speeds of up to 150Mbps uplink via 64-QAM
  • Supports LTE Broadcast, LTE Dual SIM, VoLTE, Wi-Fi calling with LTE call continuity, HD and Ultra HD Voice (EVS)
  • Supports Dual-band 802.11ac with MU-MIMO 1×1, Qualcomm IZat Gen8C and Bluetooth 4.1 LE solutions
  • Qualcomm TruSignal Antenna Boost
  • Qualcomm Quick Charge 3.0

Qualcomm Snapdragon 626 Specifications

  • Octa-Core—Quad 2GHz / 2.2GHz A53 + Quad 2GHz / 2.2GHz A53 CPUs; 14nm LPP process
  • Memory: 1 x 32-bit at 933MHz LPDDR3
  • Storage: eMMC 5.1
  • Graphics: Adreno 506 GPU
  • Supports up to 1920×1200 displays
  • Video: 4K @30fps capture; Hardware HEVC (H.265) encode and decode
  • Dual ISPs can support up to 24MP
  • Miracast supports (up to 1080p)
  • Integrated X9 LTE with Global Mode LTE FDD, LTE TDD, WCDMA (DC-HSPA+, DC-HSUPA), CDMA1x, EV-DO, TD-SCDMA and GSM/Edge
  • Cat 7 speeds of up to 300 Mbps down via 2×20 MHz carrier aggregation in the downlink and Cat 13 speeds of up to 150Mbps uplink via 64-QAM
  • Supports LTE Broadcast, LTE Dual SIM, VoLTE, Wi-Fi calling with LTE call continuity, HD and Ultra HD Voice (EVS)
  • Supports Dual-band 802.11ac with MU-MIMO 1×1, Qualcomm IZat Gen8C and Bluetooth 4.1 LE solutions
  • Qualcomm TruSignal Antenna Boost
  • Qualcomm Quick Charge 3.0

Qualcomm Snapdragon 653 Specifications

  • Octa-Core— Quad 1.95GHz A72 + Quad 1.44GHz A53 CPUs; 28nm HPm process
  • Memory: 2 x 32-bit at 933MHz LPDDR3; up to 8GB of RAM
  • Storage: eMMC 5.1
  • Graphics: Adreno 510 GPU
  • Supports up to 2560×1600 displays
  • Video: 4K @30fps, 1080p @120fps capture; Hardware HEVC (H.265) encode and decode
  • Dual ISPs can support up to 21MP ZSL
  • Miracast supports (up to 1080p)
  • Integrated X9 LTE with Global Mode LTE FDD, LTE TDD, WCDMA (DC-HSPA+, DC-HSUPA), CDMA1x, EV-DO, TD-SCDMA and GSM/Edge
  • Cat 7 speeds of up to 300 Mbps down via 2×20 MHz carrier aggregation in the downlink and Cat 13 speeds of up to 150Mbps uplink via 64-QAM
  • Supports LTE Broadcast, LTE Dual SIM, VoLTE, Wi-Fi calling with LTE call continuity, HD and Ultra HD Voice (EVS)
  • Supports Dual-band 802.11ac with MU-MIMO 1×1, Qualcomm IZat Gen8C and Bluetooth 4.1 LE solutions
  • Qualcomm Quick Charge 3.0

The Snapdragon 427 will be available sometime in 2017, while the Snapdragon 626 and 653 chipsets will find their way into mobile later this year.

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